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BGA, ECO Repair and Rework

X-Ray Inspection

We provide x-ray inspection using a Nicolet Imaging System from the leading manufacturer of x-ray inspection systems. We provide verification of solder joint quality, component and assembly failure analysis, repair verification, and Statistical Process Control (SPC) data for monitoring and optimizing the manufacturing process. We customize our services to meet or exceed the parameters of our customers.

  

Circuit Board Ball Grid Array (BGA) Rework Circuit Board Ball Grid Array (BGA) Rework

 
 

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For more information, please call 1-800-763-0242 or send email.
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